AO9431 - INVESTIGATION OF ADDITIVE MANUFACTURING OF IMPROVED CERAMIC PACKAGES FOR DETECTORS - EXPRO PLUS
Open Date: 22/02/2019
Closing Date: 19/04/2019 13:00:00
Reference Nr.: 18.1ED.04
Prog. Ref.: Technology Developme
Budget Ref.: E/0901-01 - Technology Developme
Special Prov.: BE+DK+FR+DE+IT+NL+ES+SE+CH+GB+IE+AT+NO+FI+PT+GR+LU+CZ+RO+PL+EE+HU
Tender Type: C
Price Range: 200-500 KEURO
Products: Satellites & Probes / Electronics / EEE Components / Optoelectronic Devices (including opto-couplers, LED, CCDs, displays, sensors)
Techology Domains: EEE Components and Quality / EEE Component Technologies / Optoelectronic Active and Passive Components
Directorate: Directorate of Tech, Eng. & Quality
Department: Product Assurance and Safety Department
Division: Materials & Components Technology Divisi
Contract Officer: Seynaeve, Christophe Rene R.
Industrial Policy Measure: C1 - Activities in open competition limited to the non-Larg...
The current materials used for high performance detector packaging are typically ceramics with high thermal conductivity. To preserve the flatness of the focal plane array, their coefficients of thermal expansion (CTE) closely match that of the hosted silicon sensor. AlN remains a popular choice due to its high manufacturing quality, and the processes for co-firing multilayers are well established. However, for Science mission such as GAIA, EUCLID or PLATO, the detector package is constituted of SiC, to match to the focalplane array material and to provide a very accurate thermal control of the CCDs in the order of 10's of mK. There are currently no processes for integrating internal routing in this material and so the electrical connections are implemented via additional elementssuch as direct bonding between the chip and flexible PCB. The activity will start with the study of SiC manufacturing via additivemanufacturing. This shall include investigation of methods for internal electrical routing (e.g. how to introduce metallic pathwaysthrough ceramic, what materials to use, quality of metal-ceramic interfaces, cross-contamination etc.). The output shall be a suitableprocess for fabrication of both the SiC and the integrated electrical connections. Subsequently, prototypes shall be designed and manufactured prototypes. The developed package shall go through performances assessment followed by an evaluation testing (thermalcycling, etc.).Procurement Policy: C(1) = Activity restricted to non-prime contractors (incl. SMEs). For additional information please go to EMITS news "Industrial Policy measures for non-primes, SMEs and RD entities in ESA programmes".