Semicon sp. z o.o.


Technological domains
  • TD 24 Materials and Manufacturing Processes
  • TD 17 Optoelectronics
About the subject

Company has been distributing electronic components, materials, tools, measurement equipment and accessories for over 30 years. We provide comprehensive electronic manufacturing services. We specialize in assem-bling complex projects on rigid and flexible PCBs. We provide Chip-On-Bo-ard assembly services, cable harnesses and BGA reballing. We produce la-ser cut SMT stencils. We offer stencils in the VectorGuard® standard, with nano-coatings and steps. We convert industrial single- and double-sided adhesive tapes, die cut and kiss cut. We are also the largest manufacturer of laser modules in Poland. Our services find recipients in the medical, au-tomotive, space, aviation service, science and military industries

Main products and services
  • Electronic Manufacturing Services (EMS).
  • Installation of projects on rigid and flexible PCB.
  • Chip-On-Board Assembly.
  • Installation of cable harnesses.
  • BGA Reballing.
  • Production of laser cut SMT stencils.
  • Converting industrial single- and double-sided adhesive tapes.
  • Die cut and Kiss cut patterns.
  • Production of laser modules.
Contact info
website:
http://semicon.com.pl
E-mail:
info@semicon.com.pl
Telephone:
+48 22 615 73 71, +48 22 615 64 31
Address:
ul. Zwoleńska 43/43A, 04-761 Warszawa

Contact person:
First name and last name:
Piotr Ciszewski
E-mail:
pciszewski@semicon.com.pl
Telephone:
+48 605 745 270